Semiconductor package with low profile switch node integrated heat spreader

摘要

In one implementation, a semiconductor package includes a patterned conductive carrier including partially etched segments. The semiconductor package also includes a control FET having a control drain attached to a first partially etched segment of the patterned conductive carrier. In addition, the semiconductor package includes a sync FET having a sync source and a sync gate attached to respective second and third partially etched segments of the patterned conductive carrier. The semiconductor package further includes a heat spreading conductive plate situated over a control source of the control FET and over a sync drain of the sync FET so as to couple the control source and the sync drain to a switch node segment of the patterned conductive carrier.

主权项

1. A semiconductor package comprising:
a patterned conductive carrier; a control FET having a control drain attached to a first partially etched segment of said patterned conductive carrier; a sync FET having a sync source and a sync gate attached to respective second and third partially etched segments of said patterned conductive carrier; a heat spreading conductive plate situated over a control source of said control FET and over a sync drain of said sync FET so as to couple said control source and said sync drain to a switch node segment of said patterned conductive carrier.