Method for forming lead frame land grid array

摘要

A package includes a first plated area, a second plated area, a die attached to the first plated area, and a bond coupling the die to the second plated area. The package further includes a molding encapsulating the die, the bond, and the top surfaces of the first and second plated areas, such that the bottom surfaces of the first and second plated areas are exposed exterior to the package. Additional embodiments include a method of making the package.

主权项

1. A method of packaging comprising:
a. plating a plurality of first areas on a metal layer, wherein each of the first areas comprise a first palladium layer, a nickel layer, a second palladium layer and a gold layer, wherein the gold layer is on the metal layer, the second palladium layer is on the gold layer, the nickel layer is on the second palladium layer and the first palladium layer is on the nickel layer such that the gold layer is exposed at the bottom of the first areas when the metal layer is removed; b. plating a plurality of second areas of the metal layer; c. mounting one or more dies to each of the first areas plated on the metal layer with an adhesive; d. bonding at least one wire, the wire coupling each die of the dies to at least one second area; e. encasing the metal layer, the dies and the plurality of first and second areas in a mold compound thereby forming a molded block; f. removing the metal layer from the molded block, such that the first and second areas are exposed; and g. singulating the molded block after removal of the metal layer thereby forming individual packages;wherein the plurality of second areas are contact pads that are plated such that a different one of the contact pads is adjacent to each side of the one or more dies and has sufficient length such that the contact pad extends along the entire length of the each side of the one or more dies.