Method for manufacturing multilayer printed wiring board

摘要

A multilayer printed wiring board includes a core substrate, a resin insulation layer laminated on the core substrate and a capacitor section coupled to the resin insulating layer. The capacitor section includes a first electrode including a first metal and configured to be charged by a negative charge, and a second electrode including a second metal and opposing the first electrode, the second electrode configured to be charged by a positive charge. A dielectric layer is interposed between the first electrode and second electrode, and an ionization tendency of the first metal is larger than and ionization tendency of the second metal.

主权项

1. A method for manufacturing a multilayer printed wiring board, comprising:
providing a core substrate; laminating a resin insulation layer on the core substrate; forming a capacitor section including a high-K dielectric sheet and being coupled to the resin insulation layer by:
providing a first electrode comprising a first metal,providing a second electrode opposing the first electrode, the second electrode comprising a second metal having a smaller ionization tendency than an ionization tendency of the first metal forming the first electrode,providing a dielectric layer interposed between the first and second electrode to form the high-K dielectric sheet, andproviding alignment marks in the high-K dielectric sheet; forming an outermost insulating layer over the capacitor section; forming a ground pad on the outermost insulating layer and electrically connected to the first electrode; and forming a power source pad on the outermost insulating layer and electrically connected to the second electrode, wherein said forming a capacitor section includes selecting the first metal for forming a ground electrode of the capacitor section, selecting the second metal for forming a power source electrode of the capacitor section, wherein the first and second metals are selected such that the second metal has a smaller ionization tendency than the ionization tendency of the first metal, providing said first electrode formed of the first metal, and providing said second electrode opposing the first electrode and formed of the second metal.