Power management applications of interconnect substrates

摘要

Various applications of interconnect substrates in power management systems are described.

主权项

1. An interconnect substrate for connecting a device to an assembly, the device being characterized by a device pitch and the assembly being characterized by an assembly pitch that is less than about 800 microns, the interconnect substrate comprising:
a plurality of electrically conductive structures, each of the electrically conductive structures being configured for connection to a corresponding one of a plurality of circuit nodes of the device; wherein the electrically conductive structures corresponding to at least one of the circuit nodes of the device are arranged in an alternating pattern in the interconnect substrate with the electrically conductive structures corresponding to at least one other of the circuit nodes; and wherein the device pitch is about half the assembly pitch, and wherein a width of at least some of the electrically conductive structures is at least about two times a spacing between the at least some of the electrically conductive structures.