Substrate cleaning apparatus and substrate cleaning method

摘要

A substrate cleaning device is capable of removing more diverse contaminants from substrates than ultra-low temperature aerosol ejection, while avoiding technical problems inherent to wet cleaning, such as micro-roughness, watermarks, loss of substrate material and destruction of the device structure. A substrate cleaning device for cleaning wafers to which cleaning target objects have adhered includes a cluster spraying unit which sprays the wafer with one or more types of clusters formed of cleaning preparation molecules agglomerated together, a suction unit which sucks the cleaning target objects separated by spraying the clusters of the cleaning agent molecules; and a unit for moving the wafer and the cluster spraying unit relative to the one another along the surface of the wafer W to which the cleaning target objects have adhered.

主权项

1. A substrate cleaning apparatus for cleaning a substrate to which cleaning target objects have adhered, comprising:
a cluster spraying unit for spraying the substrate with one or more types of clusters formed of cleaning agent molecules agglomerated together; a suction unit for sucking cleaning target objects separated by spraying the clusters of the cleaning agent molecules; a unit for relatively moving the substrate and the cluster spraying unit along a surface of the substrate to which the cleaning target objects have adhered; a suction pump connected to the suction unit; a container for accommodating the substrate; a vacuum pump for decreasing a pressure in the container; and cleaning agent accommodating units which accommodate cleaning agents, wherein the cluster spraying unit includes supply lines for supplying the cleaning agents from the cleaning agent accommodating units and a plurality of nozzles for spraying the cleaning agents supplied through the supply lines, wherein each of the cleaning agent accommodating units is connected to one of the nozzles through one of the supply lines in a one to one corresponding manner, wherein the nozzles are installed side by side, wherein the suction unit includes a suction line connected to the suction pump and a plurality of suction members connected to the suction pump via the suction line, each of the suction members being provided correspondingly to each of the nozzles, and wherein the supply lines are separated from the suction line.