Printed circuit board design system and method

摘要

A printed circuit board (PCB) design system and method allows for PCB layouts that can be manufactured using a PCB manufacturing technology selected from multiple PCB manufacturing technologies with minimal or no modification to the PCB layout. In accordance with the exemplary embodiment, the PCB layout is designed to meet all design rules of a High Density Interconnect (HDI) manufacturing technology while minimizing requirements for layout changes when the PCB is manufactured using an Interstitial Via Hole (IVH) manufacturing technology. An IVH PCB includes a plurality of vias positioned within reserved via areas that form connections between at least some conductive elements on the board layers. The conductive elements and the plurality of vias form a layout such that a majority of reserved via areas, of all of the reserved via areas on the printed circuit board, are adequate to accommodate mechanically drilled vias manufactured with the HDI manufacturing technology.

主权项

1. A printed circuit board comprising:
a plurality of dielectric layers comprising a plurality of inner dielectric layers positioned between a plurality of outer dielectric layers; a via positioned within a first reserved via area within at least one of the inner dielectric layers, wherein the first reserved via area meets all pertinent design rules of both a first manufacturing technology and a second manufacturing technology; and a second reserved via area, through which the via does not extend, formed at a via location of the via and within at least one inner dielectric layer above or below the inner dielectric layer in which the via is located, wherein the second reserved via area meets all pertinent design rules of the second manufacturing technology.