Packaged integrated circuit devices with through-body conductive vias, and methods of making same

摘要

A device is disclosed which includes at least one integrated circuit die, at least a portion of which is positioned in a body of encapsulant material, and at least one conductive via extending through the body of encapsulant material.

主权项

1. A method of manufacturing a semiconductor device, comprising:
encapsulating a semiconductor die with an encapsulant thereby forming a semiconductor structure having a front side and a back side, wherein the semiconductor die has an active surface generally flush with the front side, and side surfaces and a back surface embedded in the encapsulant, wherein the encapsulant is continuous; forming a conductive line at the front side of the encapsulant and the active surface of the semiconductor die; and forming a conductive via that extends from the front side to the back side of the semiconductor structure, the conductive via being in direct contact with the conductive line.