Optoelectronic semiconductor component

摘要

An optoelectronic semiconductor component is provided, having a connection carrier (2), an optoelectronic semiconductor chip (1), which is arranged on a mounting face (22) of the connection carrier (2), and a radiation-transmissive body (3), which surrounds the semiconductor chip (1), wherein the radiation-transmissive body (3) contains a silicone, the radiation-transmissive body (3) comprises at least one side face (31) which extends at least in places at an angle β of <90° to the mounting face (22) and the side face (3) is produced by a singulation process.

主权项

1. An optoelectronic semiconductor component comprising:
a connection carrier; an optoelectronic semiconductor chip, which is arranged on a mounting face of the connection carrier; and a radiation-transmissive body, which surrounds the semiconductor chip in such a way that the radiation-transmissive body envelops outer faces of the optoelectronic semiconductor chip not facing the connection carrier in form-fitting manner, wherein the radiation-transmissive body contains a silicone, wherein the radiation-transmissive body comprises four side faces, wherein each of the four side faces extends completely at an angle of less than 90° to the mounting face, such that the radiation-transmissive body takes the form of a truncated pyramid, wherein the side faces exhibit traces of a singulation process, wherein each of the four side faces is produced in its entirety by an inclined sawing process, and wherein the radiation-transmissive body comprises at least one side face, which extends at least in places at an angle of between 60° and 70° to the mounting face.