| 发明名称 |
RESIN COMPOSITE AND LED PACKAGE COMPRISING INSULATIONLAYER COMPRISING THE SAME |
| 摘要 |
<p>According to an embodiment of the present invention, a resin composition comprises: an epoxy resin; a curing agent; and an inorganic filler. The inorganic filler includes a carbon nanotube (CNT) and a zinc oxide doped with a metal oxide.</p> |
| 申请公布号 |
KR20150088521(A) |
申请公布日期 |
2015.08.03 |
| 申请号 |
KR20140008940 |
申请日期 |
2014.01.24 |
| 申请人 |
LG INNOTEK CO., LTD. |
发明人 |
YOON, JONG HEUM;GU, JIN A;KIM, BI YI;JU, SANG A |
| 分类号 |
C08L63/00;C08G59/18;C08K3/04;C08K3/22;C08K9/02;H01L23/29 |
主分类号 |
C08L63/00 |
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