发明名称 METHOD OF MANUFACTURING LIGHT RECEIVING AND EMITTING ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a light receiving and emitting device with high productivity.SOLUTION: A method of manufacturing a light receiving and emitting device includes: a light-emitting element formation step for forming a laminate 55 consisting of a plurality of semiconductor layers containing a first element X, functioning as the impurities of reverse conductivity type in a semiconductor substrate 2, as a main component on the upper surface of the one conductivity type semiconductor substrate 2, and then forming a light-emitting element 3a of a desired shape by patterning the laminate 55; and a light-receiving element formation step for forming a reverse conductivity type semiconductor region 32 on the upper surface 2a of the semiconductor substrate 2 by doping the first element X, and obtaining a light-receiving element 3b by forming pn junction to the semiconductor substrate 2. In the light-emitting element formation step, the region of the semiconductor substrate 2 becoming the reverse conductivity type semiconductor region 32 is also doped with the first element X simultaneously, during formation of the laminate 55.
申请公布号 JP2015141962(A) 申请公布日期 2015.08.03
申请号 JP20140013027 申请日期 2014.01.28
申请人 KYOCERA CORP 发明人 KISHIMOTO TATSUYA
分类号 H01L31/12;H01L21/225;H01L31/10 主分类号 H01L31/12
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