| 摘要 |
Provided is a method and an apparatus for bonding a first substrate and a second substrate. In an embodiment, a first wafer chuck has a first curved surface, and a second wafer chuck has a second curved surface. For bending the first wafer and the second wafer before bonding, the first wafer is arranged on the first wafer chuck, and the second wafer is arranged on the second wafer chuck. When the first wafer and the second wafer are bent in advance, the first wafer and the second wafer are bonded. |
