发明名称 WIRING BOARD AND ELECTRONIC DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a wiring board and an electronic device capable of miniaturization.SOLUTION: A wiring board 1 includes: an insulation substrate 2 having a side surface; and an external electrode 3 provided from the side surface of the insulation substrate 2 to the lower surface. The external electrode 3 has a plurality of protrusions 3 protruding to the inside of the insulation substrate 2 in the thickness direction of the insulation substrate 2.</p>
申请公布号 JP2015141933(A) 申请公布日期 2015.08.03
申请号 JP20140012501 申请日期 2014.01.27
申请人 KYOCERA CORP 发明人 MAEHATA SHINGO
分类号 H01L23/12 主分类号 H01L23/12
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