摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring board and an electronic device capable of miniaturization.SOLUTION: A wiring board 1 includes: an insulation substrate 2 having a side surface; and an external electrode 3 provided from the side surface of the insulation substrate 2 to the lower surface. The external electrode 3 has a plurality of protrusions 3 protruding to the inside of the insulation substrate 2 in the thickness direction of the insulation substrate 2.</p> |