| 摘要 |
<p>The present invention relates to a thermosetting adhesive composition and a coverlay film using the same. The thermosetting adhesive composition comprises, with respect to 100 parts by weight of an epoxy resin: 30 to 200 parts by weight of a thermosetting acrylic polymer; 2 to 20 parts by weight of a curing agent having a multifunctional group; and 5 to 50 parts by weight of an inorganic filler. The thermosetting adhesive composition, in accordance with the present invention, has excellent ion migration resistance characteristics by not containing sulfur and chlorine impurities, which result from acrylonitrile butadiene rubber, by applying the thermosetting acrylic polymer, forms an interpenetrating polymer network with epoxy and has high heat resistance and adhesive strength as a glycidyl group, an amine group, a hydroxyl group, a carboxyl group, and a cyan group of the thermosetting acrylic polymer are involved in the process of epoxy curing. In addition, the thermosetting adhesive composition has no carbon-carbon double bond due to butadiene, thereby not being easily degraded at high temperature and inhibiting a yellowing phenomenon.</p> |
