| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of reducing the thickness and a manufacturing method of semiconductor device.SOLUTION: A semiconductor device according to an embodiment of the invention has a through-hole and a metal part. The through-hole penetrates a base plate across the surface and the rear face thereof, and the dimension of one opening is smaller than the dimension of the other opening. The metal part is formed by means of conformal plating in the through-hole with the other opening of the through-hole closed, and the one opening of the through-hole is closed. The through-hole has a cross section perpendicular to a thickness direction of the base plate having a uniform dimension from the other opening up to a midway to the one opening, but the dimension of the cross section gets smaller from the midway to the one opening. |
