| 摘要 |
PROBLEM TO BE SOLVED: To provide a feeding part cover structure capable of preventing condensation in a feeding part, and a semiconductor manufacturing device.SOLUTION: There is provided a feeding part cover structure including: a feeding part in which a socket and a plug are fitted together; a cover structure covering the feeding part and sealing the feeding part; and a feed mechanism for feeding dry air or inert gas into the cover structure. The dry air or inert gas is fed through a gap between the feeding part and the cover structure to the inside of the cover structure. |
