| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board capable of improving reliability of a through conductor. ! SOLUTION: The wiring board comprises: an inorganic material base layer which includes a first surface and a second surface at an opposite side of the first surface and in which a plurality of holes penetrating from the first surface to the second surface are provided adjacently; a longitudinal conductor which is positioned within each hole of the base layer and formed from a conductive composition; a first wiring pattern which is provided commonly in contact with a bottom face of each longitudinal conductor that is a surface communicating to the first surface of the base layer, and not to cover areas in a part of each bottom face, on the other hand; and a second wiring pattern which is provided commonly in contact with a top face of each longitudinal conductor that is a surface communicating to the second surface of the base layer and not to cover areas in a part of each top face, on the other hand. |
