| 摘要 |
PROBLEM TO BE SOLVED: To enable a holding table to suck and hold a wafer even if a warped wafer is transported to the holding table. ! SOLUTION: A transport mechanism for transporting a wafer to a holding table sucking/holding the wafer, includes: a holding head 12 which includes a plurality of sucking/holding parts 24a-24c for sucking/holding the wafer, and a plurality of pressing members 25a-25c capable of moving between a pressing position where the pressing members press an outer peripheral portion of the wafer placed on a holding table 50 toward the holding table 50, and a retracting position where the pressing members do not contact with the wafer held by the sucking/holding parts 24a-24c; and holding head moving means 13 for making the holding head 12 approach and separate from the holding table 50. Even if the outer peripheral portion of the wafer is warped upward, the warping of the wafer is corrected on the holding table 50 to eliminate a clearance between the wafer and the holding table 50, and |
