| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device capable of enlarging a bottom diameter of a contact plug relative to a width of a wire.SOLUTION: A method of manufacturing a semiconductor device includes the following steps of: forming, on a first mask layer, a first organic film pattern having a first part having a first width in a first direction, and second and third parts having a second width smaller than the first width, and prescribing a plurality of space parts where the first, second, and third parts are continuously arranged in a second direction so that the first part is sandwiched between the second and third parts; forming an insulating film on the first organic film pattern; etching back the insulating film and partially exposing the uppermost surface of the first organic film pattern and the first mask layer provided below the first part to form rectangular frame-like sidewalls on side walls of the first parts of the respective space parts in a plan view; and removing a first sidewall part close to the second part, of one side at a long side of the sidewall, and a second sidewall part close to the third part, of the other side, to divide the sidewall into a third sidewall part and a fourth sidewall part. |
