| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive having transparency after curing, capable of being cured at low temperature (for example at 100°C or less), preventing warping even when a thin adherend (for example thin wafer) is applied, having excellent adhesiveness to a substrate and excellent in reflow detachment resistance at 260°C. ! SOLUTION: There is provided an adhesive composition containing (a) an acrylic polymer having a weight average molecular weight of 100,000 or more, (b) a compound having at least two (meth)acryloyl group and (c) an organic peroxide having 1 hour half-life temperature of 70 to 115°C. ! COPYRIGHT: (C)2015,JPO&INPIT |
