| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection apparatus and an inspection method capable of inspecting for TSV defects on a semiconductor chip.SOLUTION: The inspection apparatus for inspecting semiconductor chips having via holes penetrating a silicon substrate includes: a first probe (7-1) capable of emitting an electron beam; a sensing part (4) for detecting a result ("L"or"H") whether the via establishes the continuity; and a control section (5) that holds a piece of position information (dot circle information) of the via, controls the first probe (7-1) to move to a predetermined position based on the position information (dot circle information) and to emit electron beam to the via (TSV), and associates the result ("L"or"H") with the position information (dot circle information). |
