发明名称 HEAT TRANSFER MECHANISM AND HEAT TRANSFER BODY
摘要 PROBLEM TO BE SOLVED: To provide a heat transfer mechanism and heat transfer body, capable of forming a simple structure, improving thermal efficiency, allowing simple attachment and achieving a low cost. ! SOLUTION: A heat transfer mechanism comprises: a heat absorber 32; a radiator 31; and an heat absorbing/heat generating body 5 having heat absorbing and heat generating surfaces and arranged between the heat absorber 32 and the radiator 31. The heat absorber 32 includes a first planar part 33 having a heat absorbing planar region and a first projection part 34 projected on the reverse side surface of the first planar part, extended in a direction orthogonal to the surface and including a first heat transfer junction region. The radiator 31 includes a second planar part 2 having a heat radiating planar region and a second projection part 3 projected on the reverse side surface of the second planar part, extended in a direction orthogonal to the surface and including a second heat transfer junction regio
申请公布号 JP2015142085(A) 申请公布日期 2015.08.03
申请号 JP20140015408 申请日期 2014.01.30
申请人 NEXT INNOVATION COMBINATION COMPANY 发明人 MICHIWAKI YUTAKA
分类号 H05K7/20;H01L35/30 主分类号 H05K7/20
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