使用雷射光于绝缘基板形成贯通孔之方法;METHOD FOR FORMING THROUGH-HOLE IN INSULATING SUBSTRATE BY USING LASER BEAM

摘要

本发明提供一种有意抑制加工所需之时间之贯通孔之形成方法。;本发明系一种使用雷射光于绝缘基板形成贯通孔之方法，其包括：(1)于具有第1表面之虚设绝缘基板沿着与上述第1表面平行之一方向而相对于雷射光移动之状态下，对上述虚设绝缘基板之上述第1表面照射上述雷射光，而于上述虚设绝缘基板形成贯通孔之步骤；(2)掌握上述贯通孔相对于上述虚设绝缘基板之上述第1表面之垂线之倾斜角α(-90°<α<+90°)的步骤；及(3)除了雷射光相对于绝缘基板之第1表面之垂线倾斜角度β以外，以与上述(1)之步骤相同之条件，于上述绝缘基板形成贯通孔之步骤，且上述角度β系以与上述倾斜角α相对于上述垂线线对称而成为β=-α之方式被选定。 A method including a) forming a through-hole in a dummy substrate including a surface by radiating a laser to the surface of the dummy substrate in a state where the dummy substrate is moved relative to the laser along a direction parallel to the surface of the dummy substrate, b) determining an angle α (-90 °; α; + 90° ) of the through-hole relative to a line perpendicular to the surface of the dummy substrate, and c) forming a through-hole in the insulating substrate with the same conditions as step a) except for radiating a laser at an angle β relative to a line perpendicular to a surface of the insulating substrate. The angle β is set to be line symmetric with the angle α relative to the line perpendicular to the surface of the insulating substrate and satisfy a relationship of β