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发明名称
晶片植入结构模组
摘要
申请公布号
TWM506367
申请公布日期
2015.08.01
申请号
TW104207025
申请日期
2015.05.07
申请人
龙进自动机械股份有限公司
发明人
林钰期
分类号
H01L21/67
主分类号
H01L21/67
代理机构
代理人
胡芝 台中市西屯区惠来路3段52巷30号
主权项
一种晶片植入结构模组,系包含有: 一上板,系于一第一板体上接设一多层板,又该上板形成有复数个冲针区及非冲针区,又于该非冲针区设有复数个第一结合孔、第二结合孔及导引件;及 一底板,系于一第二板体上形成有复数个冲针区及非冲针区,其中于各冲针区接设有复数支冲针,于该非冲针区设有复数个第三结合孔、弹性装置及导柱,其中该弹性装置得接设该上板的第二结合孔,而该导柱得对应该导引件。
地址
台中市乌日区溪埧里溪南路一段680巷19号
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