触控面板、触控模组及其贴合方法;TOUCH PANEL, TOUCH MODULE AND THEIR BONDING METHOD

摘要

本发明是一种触控面板、触控模组及其贴合方法，主要系由一第一基板、一第二基板相对设置，并使其间具有一容置空间，该容置空间内注满一填充液及设置复数的支撑件，而由该填充液、支撑件在第一、第二基板间构成支撑；利用上述技术在贴合过程的固化后不会出现气泡，可大幅提高贴合良率，且光学性质优于口字胶贴合，另因第一、第二基板之间获得充分支撑，故可有效解决挠曲现象及其衍生的挠曲干扰问题。; injecting filler liquid in the accommodating space and mounting multiple support parts in the accommodating space to constitute support between the first base board and the second base board. The above step scan eliminate bubbles formed during solidification and increase a yield rate.Furthermore, an optical property of the bonding method in accordance with the present invention is better than an optical property of conventional rectangular glue bonding. In addition, the filler liquid and the multiple support parts are well supported between the first base board and the second base board to avoid bending of the first base board or the second base board.