电镀式电路板结构及其制造方法;CIRCUIT BOARD WITH ELECTROPLATED TYPE AND MANUFACTURING METHOD THEREOF

摘要

一种电镀式电路板结构的制造方法，步骤包括：提供板材，其中，板材包含有基板与第一导电层，基板具有位于相反侧的第一表面与第二表面，第一导电层位于第一表面上，且第一导电层的厚度小于第一表面与第二表面之间的距离；以非化学蚀刻方式加工于基板的第二表面，以形成贯孔，而贯孔对应于基板第一表面之部位被第一导电层所遮蔽；以电镀方式在贯孔处充填成形传导体，传导体的厚度大于第一导电层的厚度；蚀刻第一导电层以成形为相互分离的第一线路与第二线路，第一线路一体连接于传导体。本发明另提供一种上述步骤所制得的电镀式电路板结构。; processing the second surface to form a penetrating hole by a non-etching manner, wherein the first conductive layer cover the penetrating hole; forming a conductive body in the penetrating hole by an electroplating manner, wherein the thickness of the conductive body is larger than the thickness of the first conductive layer; etching the first conductive layer to form a first circuit integrally connected to the conductive body and a second circuit separated from the first circuit. The instant disclosure also provides a circuit board with electroplated type prepared by the above manufacturing method.