发明名称 复合金属箔、具有载体之复合金属箔、及使用此等所得之贴金属积层板及印刷配线板;COMPOSITE METAL FOIL, COMPOSITE METAL FOIL CONTAINING CARRIER, AND METAL CLAD LAMINATE AND PRINTED WIRING BOARD USING THE SAME
摘要 本发明之目的系提供一种兼具比铜更良好的低热膨胀性能、良好的导电性能、及以铜蚀刻液所致之良好溶解性之3种特性的印刷配线板制造用复合金属箔。为达成该目的,而采用复合金属箔等,其特征系由1层以上之铜层、1层以上之镍合金层所成之复合金属箔,且该镍合金层系以镍-钼合金形成者,将该1层以上之铜层之合计厚度设为TCu,将该1层以上之镍-钼合金层之合计厚度设为TNi-Mo时,满足0.08≦TNi-Mo/TCu≦1.70之关系。 The purpose of the present invention is to provide a composite metal foil for manufacturing printed wiring board. The composite metal foil has three properties of a low thermal expansion better than copper, excellent conductivity property, and good solubility for copper etching solution. To achieve the purpose, a composite metal foil is used, which is characterized in that the composite metal foil has more than one copper layer and more than one nickel alloy layer, wherein the nickel alloy layer is formed by nickel-molybdenum alloy. The total thickness of more than one copper layer is TCu, and the total thickness of more than one nickel-molybdenum alloy layer is TNi-Mosatisfies the relationship of 0.08 ≦ TNi-Mo/TCu≦
申请公布号 TW201531174 申请公布日期 2015.08.01
申请号 TW103145878 申请日期 2014.12.27
申请人 三井金属鑛业股份有限公司 MITSUI MINING & SMELTING CO., LTD. 发明人 清水良宪 SHIMIZU, YOSHINORI;松田光由 MATSUDA, MITSUYOSHI
分类号 H05K1/09(2006.01);H05K1/05(2006.01) 主分类号 H05K1/09(2006.01)
代理机构 代理人 谢秉原
主权项
地址 日本 JP