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发明名称
印刷电路板流体排出装置;PRINTED CIRCUIT BOARD FLUID EJECTION APPARATUS
摘要
在一范例中,一流体排出装置包括嵌设在一印刷电路板中之一列印头晶粒。流体可经由该印刷电路板中并进入该列印头晶粒内的一切入式流体馈送槽流至该列印头晶粒。
申请公布号
TW201531179
申请公布日期
2015.08.01
申请号
TW103143282
申请日期
2014.12.11
申请人
惠普发展公司有限责任合夥企业 HEWLETT-PACKARD DEVELOPMENT COMPANY, L. P.
发明人
陈 清华 CHEN, CHIEN-HUA;库米比 麦可W CUMBIE, MICHAEL W.
分类号
H05K3/00(2006.01)
主分类号
H05K3/00(2006.01)
代理机构
代理人
恽轶群陈文郎
主权项
地址
美国 US
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