Method and apparatus for analyzing shape of wafer,申请号KR20130162085-传众专利搜索

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发明名称	Method and apparatus for analyzing shape of wafer
摘要	실시 예의 웨이퍼의 형상 분석 방법은, 분석 대상인 웨이퍼를 보이는 단면 영상을 획득하는 단계와, 단면 영상에서 웨이퍼의 표면 윤곽의 좌표열을 찾는 단계 및 좌표열을 이용하여, 웨이퍼의 형상에 대한 정보를 갖는 형상 분석 데이터를 구하는 단계를 포함한다.
申请公布号	KR101540569(B1)	申请公布日期	2015.07.31
申请号	KR20130162085	申请日期	2013.12.24
申请人		发明人
分类号	H01L21/20;H01L21/66	主分类号	H01L21/20
代理机构		代理人
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