| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emitting element manufacturing method which uniformly forms a light extraction structure.SOLUTION: A light emitting element manufacturing method comprises: a step of forming on a growth substrate 11, a first semiconductor layer 15 having a first conductivity type, a luminescent layer 17 and a second semiconductor layer 19 having a second conductivity type which is a conductivity type opposite to the first conductivity type in this order; an electrode formation step of forming on a semiconductor structure layer, a first electrode 27 connected to the first semiconductor layer and a second electrode 21 connected to the second semiconductor layer; a step of forming metal bonding parts which are arranged on a support medium having an insulating surface and correspond to the first electrode and the second electrode, respectively, and electrically isolated from each other; a step of thermocompression bonding each of the first electrode and the second electrode with each of the metal bonding parts while facing the first electrode and the second electrode with the metal bonding parts; a step of removing the growth substrate; a short-circuit step of forming short-circuit wiring for short-circuiting the first electrode and the second electrode; a step of wet etching a surface of the second semiconductor layer to form an uneven structure; and a step of removing the short-circuit wiring. |
