| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a lead frame, a semiconductor device and an electronic apparatus, which can ensure sufficient solder thickness without hindering a stress relaxation function by a lead terminal.SOLUTION: A lead frame comprises: a lead terminal 21 which is solder bonded to a land 4 and subjected to solder plating 27 for improving solder wettability, in which an intermediate part of the lead terminal 21 in a longer direction of the high wettability region subjected to the solder plating 27 is covered annularly with a low wettability member 28 having wettability lower than that of the other region.</p> |
