发明名称 |
PEELING METHOD IN MANUFACTURING PROCESS OF VARIOUS FLEXIBLE DEVICES |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a substrate peeling method having high process adaptability and high productivity at low cost.SOLUTION: The peeling method of peeling a substrate and a layer to be peeled by using light irradiated from a light source in a multilayer body formed of the substrate, a photothermal exchange film, and the layer to be peeled in this order includes: producing the photothermal exchange film derived from a compound having a molecular group having light absorption at a wavelength irradiated from the light source and a silanol group and/or an alkoxy silane group; and peeling the substrate and the layer to be peeled by irradiating the photothermal exchange film with light from the light source, transmitting the substrate.</p> |
申请公布号 |
JP2015138895(A) |
申请公布日期 |
2015.07.30 |
申请号 |
JP20140010021 |
申请日期 |
2014.01.23 |
申请人 |
ASAHI KASEI E-MATERIALS CORP |
发明人 |
KANEDA TAKAYUKI;OKUDA TOSHIAKI |
分类号 |
H01L21/02;G02F1/13;H01L27/12;H01L51/50;H05B33/02;H05B33/10 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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