发明名称 PEELING METHOD IN MANUFACTURING PROCESS OF VARIOUS FLEXIBLE DEVICES
摘要 <p>PROBLEM TO BE SOLVED: To provide a substrate peeling method having high process adaptability and high productivity at low cost.SOLUTION: The peeling method of peeling a substrate and a layer to be peeled by using light irradiated from a light source in a multilayer body formed of the substrate, a photothermal exchange film, and the layer to be peeled in this order includes: producing the photothermal exchange film derived from a compound having a molecular group having light absorption at a wavelength irradiated from the light source and a silanol group and/or an alkoxy silane group; and peeling the substrate and the layer to be peeled by irradiating the photothermal exchange film with light from the light source, transmitting the substrate.</p>
申请公布号 JP2015138895(A) 申请公布日期 2015.07.30
申请号 JP20140010021 申请日期 2014.01.23
申请人 ASAHI KASEI E-MATERIALS CORP 发明人 KANEDA TAKAYUKI;OKUDA TOSHIAKI
分类号 H01L21/02;G02F1/13;H01L27/12;H01L51/50;H05B33/02;H05B33/10 主分类号 H01L21/02
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