| 发明名称 |
Packaging Methods for Semiconductor Devices, and Packaged Semiconductor Devices |
| 摘要 |
Packaging methods for semiconductor devices, and packaged semiconductor devices are disclosed. In some embodiments, a method of packaging a semiconductor device includes coupling a ring to a substrate, and coupling an integrated circuit die to the substrate within the ring. A molding material is disposed around the integrated circuit die within the ring. |
| 申请公布号 |
US2015214074(A1) |
申请公布日期 |
2015.07.30 |
| 申请号 |
US201414334433 |
申请日期 |
2014.07.17 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Liu Yu-Chih;Chang Chien-Kuo;Lin Wei-Ting;Ho Kuan-Lin;Chen Chin-Liang;Lin Shih-Yen |
| 分类号 |
H01L21/52;H01L23/053;H01L23/31;H01L21/56 |
主分类号 |
H01L21/52 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of packaging a semiconductor device, the method comprising:
coupling a ring to a substrate; coupling an integrated circuit die to the substrate within the ring; and disposing a molding material around the integrated circuit die within the ring. |
| 地址 |
Hsin-Chu TW |
