PHOTONIC SINTERING OF POLYMER THICK FILM CONDUCTOR COMPOSITIONS

摘要

This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to photonic sintering. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to photonic sintering. The invention further provides devices containing electrical conductors made by these methods.

主权项

1. An electrical device comprising an electrical conductor formed from a polymer thick film conductor composition, wherein said electrical conductor has been subjected to photonic sintering, wherein said polymer thick film conductor composition is a polymer thick film solder alloy conductor composition comprising:
a) 65 to 95 wt % SAC solder alloy powder consisting of tin, silver, and copper, wherein said tin is greater than 90 wt % of said SAC solder alloy powder, said SAC solder alloy powder consisting of particles possessing an average particle size of 2 to 18 μm and a surface area/mass ratio in the range of 0.2 to 1.3 m2/g; dispersed in (b) 5 to 35 wt % organic medium comprising:
1) a vinyl co-polymer resin of vinylidene chloride and acrylonitrile, dissolved in2) organic solvent comprising a dibasic ester; wherein the wt % of said SAC solder alloy powder and said organic medium are based on the total weight of the polymer thick film solder alloy conductor composition.