THICKNESS MEASURING DEVICE AND THICKNESS MEASURING METHOD

摘要

A thickness measuring device using ultrasonic waves is provided. A cortical bone thickness measuring device includes a plurality of oscillators, a reception waveform storage, an echo waveform synthesizing module, an inner-surface focusing waveform acquiring module, and a thickness calculating module. The plurality of oscillators are arrayed and each of the oscillators is transmittable and receivable of an ultrasonic wave. The echo waveform synthesizing module obtains an echo waveform corresponding to the ultrasonic beams by synthesizing reception waveforms of the respective oscillators stored in the reception waveform storage in advance, while scanning a focusing position of the ultrasonic beams. Concerning the obtained echo waveform, when it is determined that the beams suitably focus on an inner surface of a cortical bone as a result of an evaluation by the inner-surface focusing waveform acquiring module, the thickness calculating module calculates the thickness of the cortical bone based on the echo waveform.

主权项

1. A thickness measuring device, comprising:
a plurality of elements arranged in line, each of the elements being configured to transmit an ultrasonic wave to a target object and acquirable of an echo signal with respect to the ultrasonic wave; a reception waveform storage configured to acquire and store reception waveforms of the elements at the time the respective elements transmit the ultrasonic waves; an echo waveform synthesizing module configured to obtain echo waveforms corresponding to the ultrasonic wave while scanning a focusing position of the ultrasonic beams, each of the echo waveforms being obtained by synthesizing the reception waveforms of the respective element stored in the reception waveform storage; an inner-surface focusing waveform acquiring module configured to acquire the echo waveform in which the beams are suitably focused on an inner surface of the target object, by evaluating each of the echo waveforms obtained by the echo waveform synthesizing module; and a thickness calculating module configured to calculate a thickness of the target object based on the echo waveform acquired by the inner-surface focusing waveform acquiring module.