MANUFACTURING METHOD FOR LADDER SOLDER MASK PACKAGE PRODUCT

摘要

A manufacturing method for a ladder solder mask package product, comprising the following steps: printing a solder mask on a package substrate for the first time, and conducting the first contraposition exposure on the first layer of solder mask printed on the package substrate; printing a solder mask on the package substrate on which the first contraposition exposure is conducted for the second time, and conducting the second contraposition exposure on the second layer of solder mask printed on the package substrate; conducting developing processing on the package substrate on which the second contraposition exposure is conducted; and conducting curing processing on the package substrate on which the developing processing is conducted. In the manufacturing method, first, solder masks printed on a package product twice are respectively exposed; then, the shaded solder masks are rinsed out using a developing solution, and curing processing is conducted on the two layers of solder masks. Compared with the method in which shaded solder masks are rinsed out using a developing solution twice and are cured respectively, the step of one-time developing is omitted, and the curing step after the developing step is omitted at the same time, so that time can be saved and the production efficiency can be increased.