| 摘要 |
A photoresist composition, comprising the following components in parts by weight: 0.1-1.0 part of a polyether-modified organic silicon levelling agent 58, 7-23 parts of a multifunctional monomer, 13-29 parts of an alkali soluble resin, 23-62.8 parts of a pigment dispersion, 1.5-11.9 parts of a photoinitiator, and 10-45 parts of a solvent. This photoresist composition can solve the following problems: the poor levelling property of a film coated with the existing photoresist composition and the surface shrinkage of a film layer after high-temperature after-baking. |
