| 摘要 |
The present invention relates to an embedded printed circuit board, which comprises: an insulation substrate which includes a cavity; an element which is placed in the cavity; and an insulation layer which is formed of a heat and ultraviolet ray curable material on the insulation substrate, and includes an opening unit for exposing part of the element. Therefore, the embedded printed circuit board can form the opening unit without damage to the printed circuit board or the element, can prevent exfoliation of the insulation layer from the element, and can provide a minimized defect rate and high reliability. |
