发明名称 RESIN-BOND WIRE SAW
摘要 [Problem] To provide a resin-bond wire saw having good cutting performance and a long lifespan. [Solution] A resin-bond wire saw in which abrasive grains are fixed to the surface of the wire by a resin bond containing a novolac-type phenol resin, a resol-type phenol resin, and an amine-based silane coupling agent. The resin bond shows a plurality of peaks at intervals of 208 (m/z) that represent fragments in positive ions in MALDI-TOF-MS (mass spectrometry), and a peak that corresponds to a softening point at 175°C to 182°C in TG-DTA (differential thermal analysis).
申请公布号 SG11201504210S(A) 申请公布日期 2015.07.30
申请号 SG11201504210S 申请日期 2013.12.04
申请人 TKX CORPORATION 发明人 IKEUCHI, MASAHIKO
分类号 B24D11/00;B24B27/06;B24D3/28 主分类号 B24D11/00
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