| 发明名称 |
METHODS FOR PROCESSING SUBSTRATES |
| 摘要 |
A method for processing substrates includes providing a bonding layer between a substrate and a carrier to bond the substrate to the carrier, processing the substrate while the substrate is supported by the carrier, and removing the bonding layer to separate the substrate from the carrier. The bonding layer may include a thermosetting release layer and thermosetting glue layers, wherein at least one of the thermosetting glue layers is provided on each side of the thermosetting release layer. |
| 申请公布号 |
US2015214089(A1) |
申请公布日期 |
2015.07.30 |
| 申请号 |
US201514682231 |
申请日期 |
2015.04.09 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD |
发明人 |
LEE CHUNGSUN;AHN Jung-Seok;CHOI Kwang-chul;KANG Un-Byoung;KIM Jung-Hwan;SOHN JOONSIK;LEE JEON IL |
| 分类号 |
H01L21/683;B32B37/18;B32B37/12;B32B38/10;H01L21/02;B32B38/04;B32B37/24;H01L21/304;H01L21/768;H01L23/00;B32B37/26;B32B38/16 |
主分类号 |
H01L21/683 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for processing a substrate, the method comprising:
providing a bonding layer between the substrate and a carrier to bond the substrate to the carrier, the substrate and the carrier respectively including surfaces facing to each other; processing the substrate while the substrate is supported by the carrier; and removing the bonding layer to separate the substrate from the carrier, wherein the bonding layer includes a thermosetting release layer provided on the surface of the substrate and a thermosetting glue layer provided on the surface of the carrier, and wherein the substrate further includes a plurality of bumps on the surface thereof such that the thermosetting release layer has a curved shape extending along a profile of the bumps. |
| 地址 |
Suwon-si KR |
