| 主权项 |
1. A cooling device, comprising:
a rectangular parallelepiped housing in which a plurality of electronic components, including a heat generating electronic component, is housed; a plurality of heat-radiating side wall fins formed on an outer surface of a first side wall of the housing so as to extend in parallel with a longitudinal direction of the housing; a plurality of heat-radiating bottom fins formed on a bottom surface of a bottom portion of the housing so as to extend in parallel with the longitudinal direction; a cover member covering the plurality of side wall fins and the plurality of bottom fins from an outer side, the cover member forming a side wall cooling channel between the plurality of side wall fins, and further forming a bottom cooling channel between the bottom fins; a chamber attached to a second side wall of the housing that faces in a direction crossing the first side wall, and forming a fluid introduction chamber in a direction facing the second side wall so that the side wall cooling channel and the bottom cooling channel communicate with the fluid introduction chamber; and a coolant supply device externally attached to the chamber and supplying a coolant to the side wall and bottom cooling channels via the fluid introduction chamber, wherein the side wall fins and the bottom fins are formed in predetermined shapes, whereby an amount of the coolant supplied from the coolant supply device to the side wall cooling channel is adjusted and an amount of the coolant supplied from the coolant supply device to the bottom cooling channel is adjusted. |
