| 摘要 |
This solid-state image capturing device has a plurality of substrates overlapping each other, and the plurality of substrates are electrically connected by a connection part, the solid-state image capturing device being provided with: a pixel circuit in which photoelectric conversion parts each for converting incident light into a signal are arranged in a matrix; a first readout circuit which reads a signal from the photoelectric conversion part; a signal processing circuit which performs signal processing on the signal read out from the photoelectric conversion part; an output circuit which outputs the signal processed by the signal processing circuit to the outside; first wiring which is provided to correspond to each of four circuits of the pixel circuit, the first readout circuit, the signal processing circuit, and the output circuit, and supplies a first voltage to each of the circuits; second wiring which is provided to correspond to each of the four circuits and supplies a second voltage different from the first voltage to each of the circuits; and a capacitor which is electrically connected to the first wiring and the second wiring that correspond to at least any circuit of the four circuits, and has a first end electrically connected to the first wiring, and a second end electrically connected to the second wiring. In a substrate different from a substrate on which the corresponding circuit among the four circuits is disposed, the capacitor is disposed in a region facing the corresponding circuit. |
