ADHESIVE AGENT, ADHESIVE FILM, AND SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

摘要

The present invention relates to an adhesive agent which can be used in the mounting of a semiconductor chip on a circuit board or the like. The present invention addresses the problem of providing an adhesive agent having both excellent storage stability and excellent connection reliability. A means for solving the problem is an adhesive agent comprising (a)a polyamide, (b) an epoxy compound and (c) an acid-modified rosin.