发明名称 |
COMPOSITION FOR METAL ELECTROPLATING COMPRISING LEVELING AGENT |
摘要 |
A composition comprising a source of metal ions and at least one leveling agent comprising a linear or branched, polymeric imidazolium compound comprising the structural unit of formula L1 (L1) wherein R1, R2, R3 are each independently selected from an H atom and an organic radical having from 1 to 20 carbon atoms, R4 is a divalent, trivalent or mutlivalent organic radical which does not comprise a hydroxyl group in the α or &bgr; position relative to the nitrogen atom of the imidazole rings is an integer. |
申请公布号 |
SG10201504251W(A) |
申请公布日期 |
2015.07.30 |
申请号 |
SG10201504251W |
申请日期 |
2011.05.31 |
申请人 |
BASF SE |
发明人 |
SIEMER, MICHAEL;RÖGER-GÖPFERT, CORNELIA;MEIER, NICOLE;RAETHER, ROMAN, BENEDIKT;ARNOLD, MARCO;EMNET, CHARLOTTE;MAYER, DIETER;FLÜGEL, ALEXANDER |
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