PLASMA ETCHING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a plasma etching device that can be efficiently cooled even in an adhesion method for a protective tape or a rigid substrate.SOLUTION: The plasma etching device comprises grooves 40 and a plurality of protruding portions 41 on a holding surface 21 of a chuck table 22 that holds a work piece. The grooves 40 are formed by being communicated in a honeycomb form in which regular hexagons are planarly filled across a whole surface of the holding surface 21. The protruding portions 41 are formed protruding onto a regular hexagonal holding surface 21a in the honeycomb form. In the grooves 40 are formed a plurality of injection holes to be supplied with cooling medium gas. A protruding height of the protruding portions 41 from the holding surface 21a is formed to be equal to a height at which a backside of a protective tape contacts the holding surface 21a when the protective tape bonded to a front face of a work piece is placed in contact with the protruding portions 41.