发明名称 THREE-DIMENSIONAL POWER AMPLIFIER ARCHITECTURE
摘要 The present disclosure provides a three-dimensional (3-D) transformer-based (TF-based) power amplifier architecture, including a power splitting plane having at least one input transformer-based circuit; and a power combining plane having at least one output transformer-based circuit. The power splitting plane includes at least one input transmission line, at least one input transformer and an input terminal. Moreover, the power combining plane includes at least one output transmission line, at least one output transformer, at least one power amplifier-cell (PA-cell) and an output terminal. The power combining plane is vertically stacked, attached and electrically connected to the power splitting plane. Consequently, as compared with the existing 2-D power amplifiers, the 3-D transformer-based power amplifier architecture of the present disclosure is capable of achieving a symmetric and compact power distribution layout. Accordingly, the present disclosure further provides an integrated circuit layout for the 3-D TF-based power amplifier architecture.
申请公布号 US2015214994(A1) 申请公布日期 2015.07.30
申请号 US201414168773 申请日期 2014.01.30
申请人 National Taiwan University 发明人 Yeh Jin-Fu;Tsai Jeng-Han;Huang Tian-Wei
分类号 H04B1/40;H04B1/04;H03F3/45;H03F3/19;H03F3/21 主分类号 H04B1/40
代理机构 代理人
主权项 1. A three-dimensional (3-D) power amplifier architecture, comprising: a power splitting plane comprising at least one input transformer-based circuit having at least one input transmission line, at least one input transformer and an input terminal; and a power combining plane comprising at least one output transformer-based circuit having at least one output transmission line, at least one output transformer, at least one power amplifier-cell (PA-cell) and an output terminal, wherein the power combining plane is vertically stacked, attached and electrically connected to the power splitting plane.
地址 Taipei TW