MULTIPLE PHASE CHANGE MATERIALS IN AN INTEGRATED CIRCUIT FOR SYSTEM ON A CHIP APPLICATION

摘要

A device includes first and second pluralities of memory cells with memory elements and first and second capping materials on the first and second pluralities of memory cells. First and second capping materials can comprise lower and higher density silicon nitrides. The memory elements can include a programmable resistance memory material, and the capping materials can contact the memory elements. The first and second pluralities of memory cells can have a common cell structure. The first memory cells in the can comprise a top and bottom electrodes with a memory material therebetween and the first capping material contacting the memory material. Control circuits can apply different write algorithms to the first and second pluralities of memory cells. The first and second sets of memory cells can have different operational memory characteristics by forming the first and second capping layers using different capping materials but with the same cell structure.

主权项

1. A device, comprising:
a first plurality of memory cells and a first capping material on the first plurality of memory cells; a second plurality of memory cells and a second capping material on the second plurality of memory cells; and the first capping material being different from the second capping material.