| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition and a resin film that can collectively mold a wafer (to obtain a wafer mold), shows good moldability particularly for a large-diameter thin wafer, and gives low warpage property and good wafer protective function after molding, facilitates a molding process, and can be suitably used for a wafer level package.SOLUTION: The resin composition comprises the following components: (A) a silicone resin having a structural unit represented by composition formula (1) below and having a weight average molecular weight of 3,000 to 500,000; (B) an epoxy resin curing agent; and (C) a filler. |
