| 摘要 |
PROBLEM TO BE SOLVED: To provide a switching board capable of suppressing the diffusion of solder in the reflow soldering.SOLUTION: A switching board 10 comprises: a control circuit board 20; an insulation sheet 70; bus bars 30, 40, 50; a circuit configuration 11 having a first screw 120 fastening the control circuit board 20, the insulation sheet 70 and bus bars 30, 40, 50 each other; and semiconductor switching elements 60A, 60B having terminals 62, 63, 64. The control circuit board 20 has mounting windows 22, 23, the insulation sheet 70 has insertion windows 71, 72 arranged and overlapped with mounting windows 22, 23, bus bars 30, 40, 50 are arranged on a region exposed to an inside of mounting windows 22, 23 and insertion windows 71, 72, and comprises solder adhesion regions 32, 42, 53 on which the solder S for soldering terminals 62, 63, 64 is adhered; and control grooves 33, 43, 54 arranged around solder adhesion regions 32, 42, 53. |
