MULTILAYER WIRING BOARD

摘要

A multilayer wiring board including a multilayer body including a plurality of insulating layers includes a ground electrode for external connection disposed in a center of a lower surface of the multilayer body, a plurality of individual electrodes at an outer edge of the lower surface of the multilayer body, and a surface insulating film including an interelectrode insulating portion and a surface covering portion, the interelectrode insulating portion covering an edge portion of the ground electrode to provide insulation between the ground electrode and each of the individual electrodes, the surface covering portion being disposed on a surface of a main body of the ground electrode to divide the surface of the main body into a plurality of regions.

主权项

1. A multilayer wiring board comprising:
a multilayer body including a plurality of insulating layers stacked on each other, the multilayer wiring board including: a ground electrode located at a center or approximate center of one principal surface of the multilayer body; a plurality of individual electrodes located at an outer edge of the one principal surface of the multilayer body; and a surface insulating film including an interelectrode insulating portion and a surface covering portion, the interelectrode insulating portion covering an edge portion of the ground electrode to provide insulation between the ground electrode and each of the plurality of individual electrodes, the surface covering portion being disposed on a surface of the ground electrode to divide the ground electrode into a plurality of regions.