发明名称 INSULATING RESIN MATERIAL AND MULTILAYER SUBSTRATE
摘要 Provided is an insulating resin material capable of reducing surface roughness of the surface of a cured object, and, when a metal layer is formed on the surface of the cured object, increasing adhesive strength between the cured object and the metal layer.;The insulating resin material of the present invention includes a thermosetting resin, a curing agent, a first inorganic filler surface-treated with a first silane coupling agent, and a second inorganic filler surface-treated with a second silane coupling agent. When absolute difference between SP values of a most-abundantly contained thermosetting resin and an organic group of the first silane coupling agent is defined as SP(A), and when absolute difference between SP values of the most-abundantly contained thermosetting resin and an organic group of the second silane coupling agent is defined as SP(B); (SP(A)−SP(B)) is not smaller than 0.5 but not larger than 3.5.
申请公布号 US2015210884(A1) 申请公布日期 2015.07.30
申请号 US201314425367 申请日期 2013.09.03
申请人 SEKISUI CHEMICAL CO., LTD. 发明人 Hayashi Tatsushi;Kunikawa Tomoki;Yokota Reona;Tottori Daisuke;Shirahase Kazutaka
分类号 C09D163/00;C08K9/06;H05K1/03 主分类号 C09D163/00
代理机构 代理人
主权项 1. An insulating resin material comprising: at least one type of a thermosetting resin; a curing agent; a first inorganic filler that is surface-treated with a first silane coupling agent; and a second inorganic filler that is surface-treated with a second silane coupling agent, wherein when an absolute value of a difference between an SP value of, in the thermosetting resin in the insulating resin material, a most-abundantly contained thermosetting resin, and an SP value of an organic group that is directly coupled with a silicon atom of the first silane coupling agent and that is not an alkyl group and not an alkoxy group, is defined as SP (A), and when an absolute value of a difference between the SP value of in the thermosetting resin in the insulating resin material, the most-abundantly contained thermosetting resin, and an SP value of an organic group that is directly coupled with a silicon atom of the second silane coupling agent and that is not an alkyl group and not an alkoxy group, is defined as SP (B), (SP (A)−SP (B)) is not smaller than 0.5 but not larger than 3.5.
地址 Osaka JP